New Delhi India has reopened applications for its ambitious chipmaking program after three candidates who applied for 2022 failed to qualify for the government’s financial stimulus. The India Semiconductor Mission (ISM), which is implementing the $10 billion programme, will accept fresh applications from June 1, allowing both new and existing applicants to submit their proposals.
In a statement, the Ministry of Electronics and Information Technology (Meity) said that the revised SEMCON India program will be open till December 2024, as against a shorter period of 45 days last time.
“All the applicants who had applied under the Scheme for Establishment of Semiconductor Fab and Scheme for Establishment of Display Fab (earlier scheme) have applied under the Revised Scheme for Establishment of Semiconductor Fab and Revised Scheme for Establishment of Display Fab Submissions are permitted. After incorporating suitable amendments in their proposals,” the statement said.
Applications for the Design Linked Incentive (DLI) scheme will also be open till December 2024. The ministry said that 26 applications have been received under the DLI scheme and five have been approved.
in response to a Bloomberg Vedanta-Foxconn, the lead applicant among last year’s three applicants, will not get government approval, Union IT minister Rajiv Chandrasekhar reported on Wednesday: “The first window for more expensive 28nm fabs has been kept open for only 45 days in January 2022 and received three applicants evaluated by ISM and its advisory group. The strategy is now also encouraging mature nodes of >40nm – existing and new players can apply fresh across the various nodes for which they have the technology. It is expected that some of the existing applicants will reapply and new investors will also apply.”
The smaller the nanometer (nm) measurement, the more advanced and expensive the chip. For example, a 28nm chip consumes less power, heats up less, and performs better than a 40nm chip.
Anil Agarwal’s Vedanta Resources Plc and the semiconductor arm of Foxconn, the world’s largest contract manufacturer, have entered into a joint investment of $20 billion for a semiconductor fab plant, display-fab plant and outsourced semiconductor assembly and test (OSAT) plant at Dholera in Gujarat. was announced. The bulk of the investment was for the semiconductor fab plant.
International Semiconductor Consortium (ISMC), a joint venture between Abu Dhabi-based Next Orbit Ventures and Israel’s Tower Semiconductor, under acquisition by Intel and Singapore’s IGSS Ventures were the other two that made their applications. Mint reported earlier this year that the ISMC would resubmit its application under the revised scheme, where the subsidy was increased to 50% from the earlier 30%, and allowed to manufacture nodes above 40nm.
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Updated: June 01, 2023, 12:03 AM IST